Xiaomi XRING SoC
Xiaomi XRING O1 [2025]
- 3 nm (TSMC N3E) Process nodes
- 2+4+2+2 design CPU
- 2x Arm Cortex-X925 at 3.90 GHz
- 4x Arm Cortex-X725 at 3.40 GHz
- 2x Arm Cortex-X725 at 1.90 GHz
- 2x Arm Cortex-X520 at 1.80 GHz
- Arm Immortalis-G925 MC16 GPU at 1392 MHz
- LPDDR5T Memory supported
- Xiaomi 6-core NPU
- Xiaomi 3-core ISP
Xiaomi XRING O3 [2026]
- 3 nm (TSMC N3P) Process nodes
- All Big Core design CPU
- 2x Arm C1-Ultra at 4.35 GHz
- 4x Arm C1-Premium at 3.60 GHz
- 4x Arm C1-Pro at 3.15 GHz
- Arm Mali G2-Ultra NX MC16 GPU at 1600 MHz
- LPDDR6 Memory and UFS 4.0 Storage supported
- Xiaomi 4-core NPU
- Xiaomi 5th-gen ISP
| Product name (Model number) |
Fab | CPU | GPU | Device | Released |
|---|---|---|---|---|---|
| XRING O1 V101C0B |
3 nm TSMC N3E |
2x ARM Cortex-X925 3.90 GHz 4x ARM Cortex-A725 3.40 GHz 2x ARM Cortex-A725 1.90 GHz 2x ARM Cortex-A520 1.80 GHz |
ARM Immortalis-G925 MC16 1392 MHz |
Xiaomi 15S Pro Xiaomi Pad 7 Ultra Xiaomi Pad 7 Pro |
Q2 2025 |
| XRING O3 V11101C |
3 nm TSMC N3P |
2x ARM C1-Ultra 4.35 GHz 4x ARM C1-Premium 3.68 GHz 4x ARM C1-Pro 3.15 GHz |
ARM Mali G2-Ultra NX MC16 1600 MHz |
Xiaomi 18 Fold Xiaomi Pad 9 Pro Max |
Q3 2026 |
